Datacenter Liquid Cooling & HPC Sealing

Zero-leak tolerance sealing, EMI/RFI shielding, and rapid prototyping for advanced direct-to-chip and immersion cooling systems.

As artificial intelligence and high-performance computing (HPC) workloads scale, traditional air cooling is no longer viable. The shift to Liquid Cooling requires gaskets and seals engineered to exact tolerances to protect multi-million dollar server racks. Sealcraft partners with mechanical and thermal engineers to deliver custom sealing solutions designed specifically for advanced thermal management.

Water & Glycol Loops

We precision-cut EPDM gaskets, offering exceptional long-term resistance to glycol-based coolants and extreme temperature fluctuations without degrading or swelling in Direct-to-Chip (D2C) applications.

Dielectric Fluids

For specialized single-phase and two-phase immersion systems, we manufacture zero-contamination seals using PTFE (Teflon™) and high-grade Fluoropolymers (Viton™) designed to withstand harsh synthetic fluids.

EMI & RFI Shielding

Datacenter chassis require more than just liquid seals. We cut Conductive Elastomers (silicone filled with silver, aluminum, or nickel) to provide environmental sealing and electromagnetic interference shielding in a single part.

Rapid Prototyping for Iterative Design

Server manifold and cooling plate designs evolve rapidly. Waiting weeks for traditional steel-rule dies slows down your engineering cycle. Utilizing state-of-the-art CNC Digital Knife Technology, Sealcraft bridges the gap between CAD design and physical testing.

  • Zero Tooling Charges: We cut directly from your .DXF or .DWG files.
  • Rapid Turnaround: Prototype cutting and short-run production in a fraction of the time.
  • Complex Geometries: Perfect for intricate manifold channel seals, O-ring cord alternatives, and tight-tolerance flange gaskets.